III. JOB DESCRIPTION INFORMATION – All fields must be completed.
Responsible for continuous improvement activities under instructions to support manufacturing process, technique, and methodology. As improvement in manufacturing systems by using statistical analysis and other analytical tools to maximize production efficiency. Support the organizational goals in achieving total customer satisfaction.
PRINCIPLE ACCOUNTABILITIES / DUTIES:
Createsprogramto supportthe production report
Collectsschedule buildrequirementandexpectsoutputto achieve scheduleplan
Evaluates andindicates howto achieve the performance
Calculatesheadcountand overtime requirement
Cooperates with Production manager,IndustrialEngineerto improve efficiencyand balance headcountto properlyforoutputachievement
Definesproblemand establishes the corrective and preventive action,followsup and report.
Knows yourcustomer's expectationsand drive action to meet them
Performotherduties as properlyassigned bysupervisor/leader
Work with customer DFM engineer to define manufacturing process flow and prepare necessary tooling for PCBA
Works closely with the site to coordinate supply chain procurement activities in support of engineering builds
Publishes and reviews DFX reports with key customer representatives, including all issues found and resolved during developments, as well as yield reports and analysis.
Develops Build Plans with the project team, driving and coordinating the subsequent builds, lead times and shipments with the site.
Makes intelligent decisions to support quick turn around on sample and engineering builds.
PREVIOUS EXPERIENCE REQUIRED: (include experience required with specific software applications, equipment, or specific certifications and
Excellence math, verbal, computer, and problem solving skills required
Must be able to read and interpret schematic diagrams, technical manuals and related information
Familiar with Surface-Mount Technology (SMT) electronic components and SMT assembly process.
Familiar with SMT and PTH process especially
Familiar with solder printer, SPI, AOI, AXI, wave soldering and BGA rework machines
Familiar with soldering materials, soldering process, temperature profiling and process debug for soldering issues on PCBA.
education requirements such as MSME, MSEE, APICS, etc)PREFERRED Qualifications (nice to have skills):Minimum 5 years of hands-on process engineering experience for the PCBA assembly environment.