We are recruiting for a Sales Engineer who knows wafer and fab as it relates to Semiconductors and the processing facility- a clean room environment that turns wafers into integrated circuits.
Our client's system of products is used by Semiconductor manufacturers (and OEM tool Manufacturers) for their clean wafer processing chambers. The purpose of the process chambers is to either add or remove layers onto the wafer surface and their products are used to clean the chambers that produce the wafers. Our client manufacturers abrasives and wipers are productions proven on process chambers, end stations, electrostatic chucks, and wafer transfer robotics to reduce particle defects, test wafer usage, hazardous solvents and tool downtime - these products help increase wafer throughput more efficiently and effectively cleaning the wafer process chambers (increasing 1st pass Qual rates, reducing Tech time (hours), better OEE (Overall Equipment Efficiency).
Primary focus: US wafer Fabs. Secondary focus: Back-end test and assembly operations.
Are you familiar with or sold any of the following:
Responsible for growing Microelectronics sales, client relationships, and business development in the Americas
Overview of position:
Wafer Fab Tool Manufacturers: Successful candidates would come to form similar type companies:
Wafer Fab Parts Cleaning Companies:
Tasks: Assessing successes and failures, and then modifying the sales approach
Why? - The air inside a cleanroom is filtered and recirculated continuously, and employees wear special clothing (sometimes called ‘bunny suits’) to help keep the air particle free. If even the smallest speck of dust or other foreign materials ends up on the wafer, it can ruin the microchip, so chipmakers are careful to keep their fabs clean.
Just how clean? About 10,000 times cleaner than the outside air. Most chipmakers have ‘ISO class 1’ cleanrooms that are ‘zero dust’, meaning there are no more than 10 particles between 100 and 200 nm in size per cubic meter of air, and none larger than 200 nm. In comparison, a clean, modern hospital has about 10,000 dust particles per cubic meter. A typical wafer fab employs a series of complex steps to define conductors, transistors, resistors, and other electronic components on the semiconductor wafer. In 200-300mm wafer fabs, the advent of sub 40nm nodes and 3D memory processes have required ever tighter contamination control measures in order to maintain acceptable yields.
Our client: has pioneered innovative products that have enabled dramatic improvements in wet clean procedures and step-change reductions in particle levels on wafer processing tools. Hi-Vac qualified abrasives and wipers are production-proven on process chambers, end stations, electrostatic chucks, and wafer transfer robotics to reduce particle defects, test wafer usage, hazardous solvents, and tool downtime.
Our client's Sales/Application Engineering Staff has worked closely with the leading Tool Manufacturers and Equipment Engineers, to develop High Precision PM Procedures that drive improved tool performance and reduced cost of ownership. We have a worldwide network of factory-trained equipment engineers to help our customers upgrade vacuum chamber pm procedures.
Our client Semiconductor Wafer Fabs:
o Texas Instruments